Lead free activities of JEITA

Lead free activities of JEITA

JEITA evaluated the lift off phenomenon and control technologies available and examined the Sn-Zn-Bi and Sn-Ag-Cu solder materials. Further attention is needed for the reflow profiles and combination of components.

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Bibliographische Detailangaben
1. Verfasser: Ushio, N.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Commercialization
Connectors
Copper
Electronic components
Environmentally friendly manufacturing techniques
Land surface
Land surface temperature
Lead
Mass production
Surface cracks
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Beschreibung
Zusammenfassung:JEITA evaluated the lift off phenomenon and control technologies available and examined the Sn-Zn-Bi and Sn-Ag-Cu solder materials. Further attention is needed for the reflow profiles and combination of components.
DOI:10.1109/ECODIM.2001.992519