Broadband D-Band Patch Antenna Array in Wafer-Level Package Based on BCB Process

This paper presents a broadband stacked patch antenna array in wafer-level package based on benzocyclobutene (BCB) process for D-band wireless communications. The BCB material is not only used as a substrate for the antenna, but also as an interconnection layer, enabling low-loss interconnection wit...

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Veröffentlicht in:IEEE Open Journal of Antennas and Propagation 2022, Vol.3, p.1-1
Hauptverfasser: Wang, Xiaocheng, Xiao, Gaobiao, Yang, Lixue, Li, Hao, Xu, Qihao
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Sprache:eng
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Zusammenfassung:This paper presents a broadband stacked patch antenna array in wafer-level package based on benzocyclobutene (BCB) process for D-band wireless communications. The BCB material is not only used as a substrate for the antenna, but also as an interconnection layer, enabling low-loss interconnection with RFICs through vias and transmission lines. By introducing a BCB polymer-filled back cavity and carefully developing the feeding network, the designed antenna achieves a relative bandwidth of 18.9 the 2W2 stacked antenna array features a stable high-gain broadside radiation pattern. The pairwise antiphase feeding technique is adopted to suppress the cross-polarization level. In order to acquire high-speed data transmission, a dual-polarization MIMO implementation is presented. The port isolations are greater than 35 dB across the whole operating band.
ISSN:2637-6431
2637-6431
DOI:10.1109/OJAP.2022.3214488