Transfer and bonding process of semiconductor coupled SAW device suited for mass-production

In this paper, we propose an improved method for fabricating semiconductor coupled SAW devices using ELO film bonding process. In order to make the devices suited for mass production in fabricating process, we try to use tape carrier suitable for releasing, transferring, aligning and bonding semiconductor film. We examined physical and chemical properties of tape sheets against device fabrication process. The experimental results indicate that the tape sheets are useful for protecting and transferring Si film. We succeed in releasing Si thin films, and which were bonded on a piezoelectric substrate.