Inter-chip optical interconnects using imaging fiber bundles and integrated CMOS detectors

Inter-chip optical interconnects using imaging fiber bundles and integrated CMOS detectors

We present a novel parallel optical link for inter-chip communication. The link consists of a high-performance LED array flip-chip mounted on CMOS drivers, an imaging fiber bundle and a standard CMOS detector/receiver array. The power consumption is 4 mW and 7.5 mW per channel at 300 Mbit/s and 700...

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Hauptverfasser: Rooman, C., Kuijk, M., Windisch, R., Vounckx, R., Borghs, G., Plichta, A., Brinkmann, M., Gerstner, K., Strack, R., Van Daele, P., Woittiez, W., Baets, R., Heremans, P.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
CMOS technology
Detectors
Integrated circuit interconnections
Light emitting diodes
Optical arrays
Optical fibers
Optical imaging
Optical interconnections
Optical receivers
Sensor arrays
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Beschreibung
Zusammenfassung:We present a novel parallel optical link for inter-chip communication. The link consists of a high-performance LED array flip-chip mounted on CMOS drivers, an imaging fiber bundle and a standard CMOS detector/receiver array. The power consumption is 4 mW and 7.5 mW per channel at 300 Mbit/s and 700 Mbit/s, respectively. Each channel takes an area of merely 100 /spl mu/m /spl times/ 100 /spl mu/m.
DOI:10.1109/ECOC.2001.989635