Bending Resistant Multibit Memristor for Flexible Precision Inference Engine Application

This work reports 2-bits/cell hafnium oxide-based stacked resistive random access memory devices fabricated on flexible polyimide substrates for neuromorphic applications considering the high thermal budget. The ratio of low-resistance state current ( {I}_{ \mathrm{\scriptscriptstyle ON}} ) to high-...

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Veröffentlicht in:IEEE transactions on electron devices 2022-08, Vol.69 (8), p.4737-4743
Hauptverfasser: Pal, Parthasarathi, Lee, Ke-Jing, Thunder, Sunanda, De, Sourav, Huang, Po-Tsang, Kampfe, Thomas, Wang, Yeong-Her
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Sprache:eng
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Zusammenfassung:This work reports 2-bits/cell hafnium oxide-based stacked resistive random access memory devices fabricated on flexible polyimide substrates for neuromorphic applications considering the high thermal budget. The ratio of low-resistance state current ( {I}_{ \mathrm{\scriptscriptstyle ON}} ) to high-resistance state current ( {I}_{ \mathrm{\scriptscriptstyle OFF}} ) or {I}_{ \mathrm{\scriptscriptstyle ON}}/{I}_{ \mathrm{\scriptscriptstyle OFF}} for the fabricated devices was above 1.4\times10 3 with a low device-to-device variation at 100 \boldsymbol {\mu }\text{A} current compliance. The mechanical stability over 10 4 bending cycles at a 5 mm bending radius and endurance over 10 6 WRITE cycles makes these devices suitable for online neural network training. The data retention capability over 10 4 s at 125°C also infuses these devices' long-term inference capability. Furthermore, the performance of the devices has been verified for neuromorphic applications by system-level simulations with experimentally calibrated data. The system-level simulation reveals only a 2% loss in inference accuracy over ten years from the baseline.
ISSN:0018-9383
1557-9646
DOI:10.1109/TED.2022.3186965