Polylithic integration of SAW devices using quartz-on-silicon process for true single chip radio

Polylithic integration of SAW devices using quartz-on-silicon process for true single chip radio

Presents the performance of DTCSO (digitally temperature-compensated SAW oscillator) using PLIC (polylithic integrated circuit) technology on quartz-on-silicon wafer. A prototype DTCSO reference oscillator is designed and fabricated on a QoS wafer and shows the phase noise performance -115 dBc/Hz at...

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Hauptverfasser: Yeonwoo Ku, Yunseong Eo, Kwyro Lee
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Circuit stability
Digital integrated circuits
Energy consumption
Frequency
Integrated circuit technology
Oscillators
Phase noise
Prototypes
Surface acoustic wave devices
Surface acoustic waves
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Beschreibung
Zusammenfassung:Presents the performance of DTCSO (digitally temperature-compensated SAW oscillator) using PLIC (polylithic integrated circuit) technology on quartz-on-silicon wafer. A prototype DTCSO reference oscillator is designed and fabricated on a QoS wafer and shows the phase noise performance -115 dBc/Hz at 10 kHz offset, 7.5 mW power consumption. The frequency stability performance of 4.5 ppm is very comparable with that of bulk crystal TCXO, demonstrating the feasibility of integration of reference oscillator for high performance true single chip radio.
DOI:10.1109/ICSICT.2001.981463