Synergistic Effect of Nano-Silica and Micro-Silica Fillers on the Rheological and Thermal Properties of Epoxy Resins

This article aims to improve nanofiller dispersion in epoxy resins by using an electrostatic disperser (ED), as well as reduce costs by using a combination of microfillers and nanofillers. The ED method aids in homogenized mixing of nanofillers in epoxy resin, due to its jet elongation and shearing...

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Veröffentlicht in:IEEE transactions on industry applications 2022-09, Vol.58 (5), p.6576-6582
Hauptverfasser: Khanum, Khadija Kanwal, Kostalas, Andreas, Jayaram, Shesha H., Ulcar, John
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Sprache:eng
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Zusammenfassung:This article aims to improve nanofiller dispersion in epoxy resins by using an electrostatic disperser (ED), as well as reduce costs by using a combination of microfillers and nanofillers. The ED method aids in homogenized mixing of nanofillers in epoxy resin, due to its jet elongation and shearing effect on a polymer mix. In this article, two concentrations (7.5 wt% and 5 wt%) of nanosilica are used with resin, and the rheological properties of hybrid composites are tested before and after the addition of 50 wt% microsilica. It is observed that the electrostatic dispersion method aids in the network formation of nanosilica, unlike the high shear (HS) method, wherein clusters of nanosilica are formed. Hence, the ED method aids in reducing the viscosity values with the addition of microsilica, which is helpful in the product molding process. A plausible mechanism of filler dispersion is explained for ED and HS methods. The morphological analysis showed that the composites are brittle due to the high silica content, and that the silica fillers are dispersed well within the epoxy matrix. The flexural strength lies in the same range for both composites prepared using ED and HS methods. Thermal conductivity depends both on nanosilica and epoxy matrix dispersion, while heat deflection temperature, thermal diffusivity and specific heat depend on the dispersion method.
ISSN:0093-9994
1939-9367
DOI:10.1109/TIA.2022.3186285