Acceleration of yield enhancement activity by utilizing real-time fail bitmap analysis

A methodology to enhance baseline yield by utilizing fail bitmap (FBM) analysis is presented in this paper. Yield impact of each process step is estimated from FBM-defect correlation and FBM classification. Statistical accuracy of the data is evaluated by using actual wafer-to-wafer variation of our...

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Hauptverfasser: Wataru Shindo, Sugimoto, S., Makara, R., Rattanalangkan, P., Lui, R.
Format: Tagungsbericht
Sprache:eng
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Zusammenfassung:A methodology to enhance baseline yield by utilizing fail bitmap (FBM) analysis is presented in this paper. Yield impact of each process step is estimated from FBM-defect correlation and FBM classification. Statistical accuracy of the data is evaluated by using actual wafer-to-wafer variation of our fab, and is significantly improved by increasing FBM sample size. In order to analyze a large amount of data in real-time manner, throughput of the data analysis is also enhanced by an automated system for timely data feedback to yield enhancement activities.
DOI:10.1109/ISSM.2001.962965