Low cost and high reliability CMOS technologies, by "retro process sequence"

Low cost and high reliability CMOS technologies, by "retro process sequence"

Describes a novel low-cost CMOS process, which reduces the number of process modules by reversing the process sequence before gate electrode formation, "retro process sequence". The damage of gate oxide from ion implantation and heat treatment are investigated by TDDB and burn-in. The resu...

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Bibliographische Detailangaben
Hauptverfasser: Sekikawa, N., Ando, W., Momen, M., Hirata, K.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
CMOS process
CMOS technology
Costs
Degradation
Electrodes
Heat treatment
Implants
Ion implantation
Oxidation
Temperature
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Beschreibung
Zusammenfassung:Describes a novel low-cost CMOS process, which reduces the number of process modules by reversing the process sequence before gate electrode formation, "retro process sequence". The damage of gate oxide from ion implantation and heat treatment are investigated by TDDB and burn-in. The results suggest this novel process can be applied to LSIs. It is possible to cut down the production cost of wafer before gate electrode formation by 40%.
DOI:10.1109/ISSM.2001.962951