An opto-electronic multi-chip module for chip-scale interconnects

An opto-electronic multi-chip module for chip-scale interconnects

Summary form only given. We have demonstrated an integrated optoelectronic MCM that uses a glass substrate as a mechanical carrier for the VCSEL, VCSEL driver, and diffractive element. Over a distance a little longer than 1 mm, our system fanned-out a single VCSEL into 60 individual fan-outs.

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Bibliographische Detailangaben
Hauptverfasser: Prather, D.W., Venkataraman, S., LeCompte, M.R., Campos, B., Kiamilev, F., Mait, J.N., Simonis, G.J.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Ceramics
Fiber lasers
Integrated circuit interconnections
Laser modes
Optical receivers
Optical transmitters
Robots
Silicon
Transceivers
Wavelength division multiplexing
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Beschreibung
Zusammenfassung:Summary form only given. We have demonstrated an integrated optoelectronic MCM that uses a glass substrate as a mechanical carrier for the VCSEL, VCSEL driver, and diffractive element. Over a distance a little longer than 1 mm, our system fanned-out a single VCSEL into 60 individual fan-outs.
DOI:10.1109/CLEO.2001.947436