A Simultaneous Multicomponent Measurement Method of Thermal Stress Based on DSSPI

Traditional thermal stress measurement methods usually assume that the stress is generated only in one direction and cannot measure multidimensional stress components in real time. To realize the real-time and full-field measurement of multiple components of thermal stress, we improved the digital speckle shearing pattern interferometry method and predigested the measurement structure. Additionally, we were able to simplify the measurement process and measure the out-of-plane as well as the in-plane components of the stress tensor at the same time without the symmetric dual-beam illumination or phase-shifting devices. In this article, we demonstrated the possibility of measuring three component gradients { \boldsymbol {\partial u}} /{ \boldsymbol {\partial x}} , { \boldsymbol {\partial v}} / { \boldsymbol {\partial x}} , and { \boldsymbol {\partial w}} /{ \boldsymbol {\partial x}} , and carried out experiments proving that this method allows for measuring the multicomponent thermal stress measurement of the object under the premise of certain mechanical structure.