Chemical-solution processing and patterning of integrated ferroelectrics
In this paper we report the chemical-solution processing of dense insulating ferroelectric thin layers with emphasis on the patterning of device structures. A review is presented for a wide range of patterning techniques and details are reported for new additive methods that appear suited for ferroe...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Tagungsbericht |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | 10 vol. 1 |
---|---|
container_issue | |
container_start_page | 5 |
container_title | |
container_volume | 1 |
creator | Mikalsen, E.A. Payne, D.A. Clem, P.G. |
description | In this paper we report the chemical-solution processing of dense insulating ferroelectric thin layers with emphasis on the patterning of device structures. A review is presented for a wide range of patterning techniques and details are reported for new additive methods that appear suited for ferroelectric applications. |
doi_str_mv | 10.1109/ISAF.2000.941502 |
format | Conference Proceeding |
fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_941502</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>941502</ieee_id><sourcerecordid>941502</sourcerecordid><originalsourceid>FETCH-ieee_primary_9415023</originalsourceid><addsrcrecordid>eNp9jj0PgjAURV_8SAR1N079A-ADishoiARn3U2DD6yBlrR18N-r0dnp5ubck1yAVYRhFGG-OZ72ZRgjYpjzKMV4BF6cZGmAnO_G4GO2wyTNOcYT8N77POBZwmfgW3tHfHtb7kFV3KiXtegCq7uHk1qxweiarJWqZUJd2SCcI6M-VTdMKketEY6urCFjNHVUOyNru4BpIzpLy1_OYV0ezkUVSCK6DEb2wjwv36PJX_gCLnM_Kw</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Chemical-solution processing and patterning of integrated ferroelectrics</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Mikalsen, E.A. ; Payne, D.A. ; Clem, P.G.</creator><creatorcontrib>Mikalsen, E.A. ; Payne, D.A. ; Clem, P.G.</creatorcontrib><description>In this paper we report the chemical-solution processing of dense insulating ferroelectric thin layers with emphasis on the patterning of device structures. A review is presented for a wide range of patterning techniques and details are reported for new additive methods that appear suited for ferroelectric applications.</description><identifier>ISSN: 1099-4734</identifier><identifier>ISBN: 0780359402</identifier><identifier>ISBN: 9780780359406</identifier><identifier>EISSN: 2375-0448</identifier><identifier>DOI: 10.1109/ISAF.2000.941502</identifier><language>eng</language><publisher>IEEE</publisher><subject>Chemical processes ; Ferroelectric materials ; Insulation ; Laboratories ; Lead compounds ; Optical materials ; Polarization ; Residual stresses ; Substrates ; Thermal stresses</subject><ispartof>ISAF 2000. Proceedings of the 2000 12th IEEE International Symposium on Applications of Ferroelectrics (IEEE Cat. No.00CH37076), 2000, Vol.1, p.5-10 vol. 1</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/941502$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2056,4048,4049,27924,54919</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/941502$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Mikalsen, E.A.</creatorcontrib><creatorcontrib>Payne, D.A.</creatorcontrib><creatorcontrib>Clem, P.G.</creatorcontrib><title>Chemical-solution processing and patterning of integrated ferroelectrics</title><title>ISAF 2000. Proceedings of the 2000 12th IEEE International Symposium on Applications of Ferroelectrics (IEEE Cat. No.00CH37076)</title><addtitle>ISAF</addtitle><description>In this paper we report the chemical-solution processing of dense insulating ferroelectric thin layers with emphasis on the patterning of device structures. A review is presented for a wide range of patterning techniques and details are reported for new additive methods that appear suited for ferroelectric applications.</description><subject>Chemical processes</subject><subject>Ferroelectric materials</subject><subject>Insulation</subject><subject>Laboratories</subject><subject>Lead compounds</subject><subject>Optical materials</subject><subject>Polarization</subject><subject>Residual stresses</subject><subject>Substrates</subject><subject>Thermal stresses</subject><issn>1099-4734</issn><issn>2375-0448</issn><isbn>0780359402</isbn><isbn>9780780359406</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2000</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNp9jj0PgjAURV_8SAR1N079A-ADishoiARn3U2DD6yBlrR18N-r0dnp5ubck1yAVYRhFGG-OZ72ZRgjYpjzKMV4BF6cZGmAnO_G4GO2wyTNOcYT8N77POBZwmfgW3tHfHtb7kFV3KiXtegCq7uHk1qxweiarJWqZUJd2SCcI6M-VTdMKketEY6urCFjNHVUOyNru4BpIzpLy1_OYV0ezkUVSCK6DEb2wjwv36PJX_gCLnM_Kw</recordid><startdate>2000</startdate><enddate>2000</enddate><creator>Mikalsen, E.A.</creator><creator>Payne, D.A.</creator><creator>Clem, P.G.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>2000</creationdate><title>Chemical-solution processing and patterning of integrated ferroelectrics</title><author>Mikalsen, E.A. ; Payne, D.A. ; Clem, P.G.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-ieee_primary_9415023</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2000</creationdate><topic>Chemical processes</topic><topic>Ferroelectric materials</topic><topic>Insulation</topic><topic>Laboratories</topic><topic>Lead compounds</topic><topic>Optical materials</topic><topic>Polarization</topic><topic>Residual stresses</topic><topic>Substrates</topic><topic>Thermal stresses</topic><toplevel>online_resources</toplevel><creatorcontrib>Mikalsen, E.A.</creatorcontrib><creatorcontrib>Payne, D.A.</creatorcontrib><creatorcontrib>Clem, P.G.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Mikalsen, E.A.</au><au>Payne, D.A.</au><au>Clem, P.G.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Chemical-solution processing and patterning of integrated ferroelectrics</atitle><btitle>ISAF 2000. Proceedings of the 2000 12th IEEE International Symposium on Applications of Ferroelectrics (IEEE Cat. No.00CH37076)</btitle><stitle>ISAF</stitle><date>2000</date><risdate>2000</risdate><volume>1</volume><spage>5</spage><epage>10 vol. 1</epage><pages>5-10 vol. 1</pages><issn>1099-4734</issn><eissn>2375-0448</eissn><isbn>0780359402</isbn><isbn>9780780359406</isbn><abstract>In this paper we report the chemical-solution processing of dense insulating ferroelectric thin layers with emphasis on the patterning of device structures. A review is presented for a wide range of patterning techniques and details are reported for new additive methods that appear suited for ferroelectric applications.</abstract><pub>IEEE</pub><doi>10.1109/ISAF.2000.941502</doi></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | ISSN: 1099-4734 |
ispartof | ISAF 2000. Proceedings of the 2000 12th IEEE International Symposium on Applications of Ferroelectrics (IEEE Cat. No.00CH37076), 2000, Vol.1, p.5-10 vol. 1 |
issn | 1099-4734 2375-0448 |
language | eng |
recordid | cdi_ieee_primary_941502 |
source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Chemical processes Ferroelectric materials Insulation Laboratories Lead compounds Optical materials Polarization Residual stresses Substrates Thermal stresses |
title | Chemical-solution processing and patterning of integrated ferroelectrics |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T18%3A15%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Chemical-solution%20processing%20and%20patterning%20of%20integrated%20ferroelectrics&rft.btitle=ISAF%202000.%20Proceedings%20of%20the%202000%2012th%20IEEE%20International%20Symposium%20on%20Applications%20of%20Ferroelectrics%20(IEEE%20Cat.%20No.00CH37076)&rft.au=Mikalsen,%20E.A.&rft.date=2000&rft.volume=1&rft.spage=5&rft.epage=10%20vol.%201&rft.pages=5-10%20vol.%201&rft.issn=1099-4734&rft.eissn=2375-0448&rft.isbn=0780359402&rft.isbn_list=9780780359406&rft_id=info:doi/10.1109/ISAF.2000.941502&rft_dat=%3Cieee_6IE%3E941502%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=941502&rfr_iscdi=true |