The effect of emitter implant and anneal on high-voltage 4H-SiC BJTs

We previously reported the first implanted-emitter bipolar transistor in 4H-SiC. The device showed a record-high common emitter current gain of 40, and forward drop of 1 V at forward current density of 50A/cm/sup 2/. The open-base breakdown voltage was less than 60 V due to the very small base width...

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description We previously reported the first implanted-emitter bipolar transistor in 4H-SiC. The device showed a record-high common emitter current gain of 40, and forward drop of 1 V at forward current density of 50A/cm/sup 2/. The open-base breakdown voltage was less than 60 V due to the very small base width (
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The device showed a record-high common emitter current gain of 40, and forward drop of 1 V at forward current density of 50A/cm/sup 2/. The open-base breakdown voltage was less than 60 V due to the very small base width (&lt;0.2 μm). In this work, improved epi-base, implanted-emitter, npn bipolar junction transistor is reported with increased base width and improved emitter anneal. The devices showed a blocking voltage of 500 V and maximum common emitter current gain of 8. Negative temperature coefficient is observed.</description><identifier>ISBN: 9780780370142</identifier><identifier>ISBN: 0780370147</identifier><identifier>DOI: 10.1109/DRC.2001.937935</identifier><language>eng</language><publisher>IEEE</publisher><subject>Annealing ; Bipolar transistors ; Contracts ; Doping ; Electric breakdown ; Implants ; Manufacturing ; Silicon carbide ; Temperature ; Voltage</subject><ispartof>Device Research Conference. Conference Digest (Cat. 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The device showed a record-high common emitter current gain of 40, and forward drop of 1 V at forward current density of 50A/cm/sup 2/. The open-base breakdown voltage was less than 60 V due to the very small base width (&lt;0.2 μm). In this work, improved epi-base, implanted-emitter, npn bipolar junction transistor is reported with increased base width and improved emitter anneal. The devices showed a blocking voltage of 500 V and maximum common emitter current gain of 8. Negative temperature coefficient is observed.</description><subject>Annealing</subject><subject>Bipolar transistors</subject><subject>Contracts</subject><subject>Doping</subject><subject>Electric breakdown</subject><subject>Implants</subject><subject>Manufacturing</subject><subject>Silicon carbide</subject><subject>Temperature</subject><subject>Voltage</subject><isbn>9780780370142</isbn><isbn>0780370147</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2001</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNp9jj0LwjAURQMiKNpZcHp_oDVp0tastoo4avcS9KWNpB80QfDfW9DZyz3c4SyXkA2jEWNU7oprHsWUskjyTPJkRgKZ7elUnlEm4gUJnHvSKSIRIk2XpCgbBNQa7x56Ddga73EE0w5WdR5U95joUFnoO2hM3YSv3npVI4hzeDM5HC6lW5O5VtZh8NsV2Z6OZX4ODSJWw2haNb6r7yX-V34AwDs4Yg</recordid><startdate>2001</startdate><enddate>2001</enddate><creator>Yi Tang</creator><creator>Fedison, J.B.</creator><creator>Chow, T.P.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2001</creationdate><title>The effect of emitter implant and anneal on high-voltage 4H-SiC BJTs</title><author>Yi Tang ; Fedison, J.B. ; Chow, T.P.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-ieee_primary_9379353</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2001</creationdate><topic>Annealing</topic><topic>Bipolar transistors</topic><topic>Contracts</topic><topic>Doping</topic><topic>Electric breakdown</topic><topic>Implants</topic><topic>Manufacturing</topic><topic>Silicon carbide</topic><topic>Temperature</topic><topic>Voltage</topic><toplevel>online_resources</toplevel><creatorcontrib>Yi Tang</creatorcontrib><creatorcontrib>Fedison, J.B.</creatorcontrib><creatorcontrib>Chow, T.P.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yi Tang</au><au>Fedison, J.B.</au><au>Chow, T.P.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>The effect of emitter implant and anneal on high-voltage 4H-SiC BJTs</atitle><btitle>Device Research Conference. Conference Digest (Cat. No.01TH8561)</btitle><stitle>DRC</stitle><date>2001</date><risdate>2001</risdate><spage>209</spage><epage>210</epage><pages>209-210</pages><isbn>9780780370142</isbn><isbn>0780370147</isbn><abstract>We previously reported the first implanted-emitter bipolar transistor in 4H-SiC. The device showed a record-high common emitter current gain of 40, and forward drop of 1 V at forward current density of 50A/cm/sup 2/. The open-base breakdown voltage was less than 60 V due to the very small base width (&lt;0.2 μm). In this work, improved epi-base, implanted-emitter, npn bipolar junction transistor is reported with increased base width and improved emitter anneal. The devices showed a blocking voltage of 500 V and maximum common emitter current gain of 8. Negative temperature coefficient is observed.</abstract><pub>IEEE</pub><doi>10.1109/DRC.2001.937935</doi></addata></record>
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ispartof Device Research Conference. Conference Digest (Cat. No.01TH8561), 2001, p.209-210
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subjects Annealing
Bipolar transistors
Contracts
Doping
Electric breakdown
Implants
Manufacturing
Silicon carbide
Temperature
Voltage
title The effect of emitter implant and anneal on high-voltage 4H-SiC BJTs
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