The effect of emitter implant and anneal on high-voltage 4H-SiC BJTs
We previously reported the first implanted-emitter bipolar transistor in 4H-SiC. The device showed a record-high common emitter current gain of 40, and forward drop of 1 V at forward current density of 50A/cm/sup 2/. The open-base breakdown voltage was less than 60 V due to the very small base width...
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creator | Yi Tang Fedison, J.B. Chow, T.P. |
description | We previously reported the first implanted-emitter bipolar transistor in 4H-SiC. The device showed a record-high common emitter current gain of 40, and forward drop of 1 V at forward current density of 50A/cm/sup 2/. The open-base breakdown voltage was less than 60 V due to the very small base width ( |
doi_str_mv | 10.1109/DRC.2001.937935 |
format | Conference Proceeding |
fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_937935</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>937935</ieee_id><sourcerecordid>937935</sourcerecordid><originalsourceid>FETCH-ieee_primary_9379353</originalsourceid><addsrcrecordid>eNp9jj0LwjAURQMiKNpZcHp_oDVp0tastoo4avcS9KWNpB80QfDfW9DZyz3c4SyXkA2jEWNU7oprHsWUskjyTPJkRgKZ7elUnlEm4gUJnHvSKSIRIk2XpCgbBNQa7x56Ddga73EE0w5WdR5U95joUFnoO2hM3YSv3npVI4hzeDM5HC6lW5O5VtZh8NsV2Z6OZX4ODSJWw2haNb6r7yX-V34AwDs4Yg</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>The effect of emitter implant and anneal on high-voltage 4H-SiC BJTs</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Yi Tang ; Fedison, J.B. ; Chow, T.P.</creator><creatorcontrib>Yi Tang ; Fedison, J.B. ; Chow, T.P.</creatorcontrib><description>We previously reported the first implanted-emitter bipolar transistor in 4H-SiC. The device showed a record-high common emitter current gain of 40, and forward drop of 1 V at forward current density of 50A/cm/sup 2/. The open-base breakdown voltage was less than 60 V due to the very small base width (<0.2 μm). In this work, improved epi-base, implanted-emitter, npn bipolar junction transistor is reported with increased base width and improved emitter anneal. The devices showed a blocking voltage of 500 V and maximum common emitter current gain of 8. Negative temperature coefficient is observed.</description><identifier>ISBN: 9780780370142</identifier><identifier>ISBN: 0780370147</identifier><identifier>DOI: 10.1109/DRC.2001.937935</identifier><language>eng</language><publisher>IEEE</publisher><subject>Annealing ; Bipolar transistors ; Contracts ; Doping ; Electric breakdown ; Implants ; Manufacturing ; Silicon carbide ; Temperature ; Voltage</subject><ispartof>Device Research Conference. Conference Digest (Cat. No.01TH8561), 2001, p.209-210</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/937935$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/937935$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Yi Tang</creatorcontrib><creatorcontrib>Fedison, J.B.</creatorcontrib><creatorcontrib>Chow, T.P.</creatorcontrib><title>The effect of emitter implant and anneal on high-voltage 4H-SiC BJTs</title><title>Device Research Conference. Conference Digest (Cat. No.01TH8561)</title><addtitle>DRC</addtitle><description>We previously reported the first implanted-emitter bipolar transistor in 4H-SiC. The device showed a record-high common emitter current gain of 40, and forward drop of 1 V at forward current density of 50A/cm/sup 2/. The open-base breakdown voltage was less than 60 V due to the very small base width (<0.2 μm). In this work, improved epi-base, implanted-emitter, npn bipolar junction transistor is reported with increased base width and improved emitter anneal. The devices showed a blocking voltage of 500 V and maximum common emitter current gain of 8. Negative temperature coefficient is observed.</description><subject>Annealing</subject><subject>Bipolar transistors</subject><subject>Contracts</subject><subject>Doping</subject><subject>Electric breakdown</subject><subject>Implants</subject><subject>Manufacturing</subject><subject>Silicon carbide</subject><subject>Temperature</subject><subject>Voltage</subject><isbn>9780780370142</isbn><isbn>0780370147</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2001</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNp9jj0LwjAURQMiKNpZcHp_oDVp0tastoo4avcS9KWNpB80QfDfW9DZyz3c4SyXkA2jEWNU7oprHsWUskjyTPJkRgKZ7elUnlEm4gUJnHvSKSIRIk2XpCgbBNQa7x56Ddga73EE0w5WdR5U95joUFnoO2hM3YSv3npVI4hzeDM5HC6lW5O5VtZh8NsV2Z6OZX4ODSJWw2haNb6r7yX-V34AwDs4Yg</recordid><startdate>2001</startdate><enddate>2001</enddate><creator>Yi Tang</creator><creator>Fedison, J.B.</creator><creator>Chow, T.P.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2001</creationdate><title>The effect of emitter implant and anneal on high-voltage 4H-SiC BJTs</title><author>Yi Tang ; Fedison, J.B. ; Chow, T.P.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-ieee_primary_9379353</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2001</creationdate><topic>Annealing</topic><topic>Bipolar transistors</topic><topic>Contracts</topic><topic>Doping</topic><topic>Electric breakdown</topic><topic>Implants</topic><topic>Manufacturing</topic><topic>Silicon carbide</topic><topic>Temperature</topic><topic>Voltage</topic><toplevel>online_resources</toplevel><creatorcontrib>Yi Tang</creatorcontrib><creatorcontrib>Fedison, J.B.</creatorcontrib><creatorcontrib>Chow, T.P.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yi Tang</au><au>Fedison, J.B.</au><au>Chow, T.P.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>The effect of emitter implant and anneal on high-voltage 4H-SiC BJTs</atitle><btitle>Device Research Conference. Conference Digest (Cat. No.01TH8561)</btitle><stitle>DRC</stitle><date>2001</date><risdate>2001</risdate><spage>209</spage><epage>210</epage><pages>209-210</pages><isbn>9780780370142</isbn><isbn>0780370147</isbn><abstract>We previously reported the first implanted-emitter bipolar transistor in 4H-SiC. The device showed a record-high common emitter current gain of 40, and forward drop of 1 V at forward current density of 50A/cm/sup 2/. The open-base breakdown voltage was less than 60 V due to the very small base width (<0.2 μm). In this work, improved epi-base, implanted-emitter, npn bipolar junction transistor is reported with increased base width and improved emitter anneal. The devices showed a blocking voltage of 500 V and maximum common emitter current gain of 8. Negative temperature coefficient is observed.</abstract><pub>IEEE</pub><doi>10.1109/DRC.2001.937935</doi></addata></record> |
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ispartof | Device Research Conference. Conference Digest (Cat. No.01TH8561), 2001, p.209-210 |
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language | eng |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Annealing Bipolar transistors Contracts Doping Electric breakdown Implants Manufacturing Silicon carbide Temperature Voltage |
title | The effect of emitter implant and anneal on high-voltage 4H-SiC BJTs |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T05%3A05%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=The%20effect%20of%20emitter%20implant%20and%20anneal%20on%20high-voltage%204H-SiC%20BJTs&rft.btitle=Device%20Research%20Conference.%20Conference%20Digest%20(Cat.%20No.01TH8561)&rft.au=Yi%20Tang&rft.date=2001&rft.spage=209&rft.epage=210&rft.pages=209-210&rft.isbn=9780780370142&rft.isbn_list=0780370147&rft_id=info:doi/10.1109/DRC.2001.937935&rft_dat=%3Cieee_6IE%3E937935%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=937935&rfr_iscdi=true |