Design of Substrate-Integrated Dielectric Resonator Antenna With Dielectric Vias
For the first time, dielectric vias were used to design a substrate-integrated dielectric resonator antenna (SIDRA). The dielectric vias consist of cylindrical holes drilled into the PCB substrate and filled with presintered nanoparticles of barium strontium titanate (BST). The BST nanoparticles wer...
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Veröffentlicht in: | IEEE transactions on antennas and propagation 2021-09, Vol.69 (9), p.5205-5214 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | For the first time, dielectric vias were used to design a substrate-integrated dielectric resonator antenna (SIDRA). The dielectric vias consist of cylindrical holes drilled into the PCB substrate and filled with presintered nanoparticles of barium strontium titanate (BST). The BST nanoparticles were found to have a dielectric constant of 20, with an approximate loss tangent of ~0.05. The dielectric-vias loaded substrate constitutes an effective medium for the DRA design. The dielectric vias are arranged in a concentric manner around a core substrate material region, giving a wideband multiring SIDRA. It was found that the wideband behavior is due to two different dielectric resonator modes, namely, the TE _{\delta 11} mode and TE _{\delta 31} half-mode. The TE _{\delta 31} half-mode is a modified version of the TE _{\delta 31} -mode of a regular dielectric resonator and is reported here for the first time. The measured and simulated −10-dB impedance bandwidths of the DRA are 33.4% and 35.8%, respectively. |
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ISSN: | 0018-926X 1558-2221 |
DOI: | 10.1109/TAP.2021.3060054 |