Multibit Ferroelectric FET Based on Nonidentical Double HfZrO2 for High-Density Nonvolatile Memory

A double-HZO (HfZrO 2 ) FeFET (ferroelectric FET) with nonidentical ferroelectric thicknesses is experimentally demonstrated with as low as \vert {V}_{P/{E}}\vert = {5} V, 2-bit endurance > 10 5 cycles and retention > 10 4 s. Inserting an insulator to separate the ferroelectric layers and av...

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Veröffentlicht in:IEEE electron device letters 2021-04, Vol.42 (4), p.617-620
Hauptverfasser: Liao, C.-Y., Hsiang, K.-Y., Hsieh, F.-C., Chiang, S.-H., Chang, S.-H., Liu, J.-H., Lou, C.-F., Lin, C.-Y., Chen, T.-C., Chang, C.-S., Lee, M. H.
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Sprache:eng
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Zusammenfassung:A double-HZO (HfZrO 2 ) FeFET (ferroelectric FET) with nonidentical ferroelectric thicknesses is experimentally demonstrated with as low as \vert {V}_{P/{E}}\vert = {5} V, 2-bit endurance > 10 5 cycles and retention > 10 4 s. Inserting an insulator to separate the ferroelectric layers and avoid the monoclinic formation of a thick Fe-HZO (ferroelectric-HZO) is a useful method to enhance the MW (memory window) for MLC (multilevel cell) applications. Double-HZO has a lower ER (error rate) and shows a 600X improvement compared to single-HZO. The stacked HZO FeFET has potential as an MLC for high-density NVM (nonvolatile memory) applications.
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2021.3060589