Anamorphic and aspheric microlenses and microlens arrays for telecommunication applications
A wafer-based fabrication process used to produce surface-relief microlenses for telecommunication applications is presented. Anamorphic and aspheric collimating lens profiles can be achieved, and samples have been measured to achieve insertion losses less than 0.2 dB/pair.
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| creator | Raguin, D.H. Gretton, G. Mauer, D. Piscani, E. Prince, E. Sales, T.R.M. Schertler, D. |
| description | A wafer-based fabrication process used to produce surface-relief microlenses for telecommunication applications is presented. Anamorphic and aspheric collimating lens profiles can be achieved, and samples have been measured to achieve insertion losses less than 0.2 dB/pair. |
| doi_str_mv | 10.1109/OFC.2001.927886 |
| format | Conference Proceeding |
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| identifier | ISBN: 9781557526557 |
| ispartof | OFC 2001. Optical Fiber Communication Conference and Exhibit. Technical Digest Postconference Edition (IEEE Cat. 01CH37171), 2001, Vol.1, p.MK1-MK1 |
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| language | eng |
| recordid | cdi_ieee_primary_927886 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Etching Lenses Microoptics Optical coupling Optical device fabrication Optical refraction Optical surface waves Photonics Resists Silicon compounds |
| title | Anamorphic and aspheric microlenses and microlens arrays for telecommunication applications |
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