Anamorphic and aspheric microlenses and microlens arrays for telecommunication applications

Anamorphic and aspheric microlenses and microlens arrays for telecommunication applications

A wafer-based fabrication process used to produce surface-relief microlenses for telecommunication applications is presented. Anamorphic and aspheric collimating lens profiles can be achieved, and samples have been measured to achieve insertion losses less than 0.2 dB/pair.

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Bibliographische Detailangaben
Hauptverfasser: Raguin, D.H., Gretton, G., Mauer, D., Piscani, E., Prince, E., Sales, T.R.M., Schertler, D.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Etching
Lenses
Microoptics
Optical coupling
Optical device fabrication
Optical refraction
Optical surface waves
Photonics
Resists
Silicon compounds
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Beschreibung
Zusammenfassung:A wafer-based fabrication process used to produce surface-relief microlenses for telecommunication applications is presented. Anamorphic and aspheric collimating lens profiles can be achieved, and samples have been measured to achieve insertion losses less than 0.2 dB/pair.
DOI:10.1109/OFC.2001.927886