The effects of plasma-induced damage on transistor degradation and the relationship to field programmable gate array performance

The impact of plasma-induced damage on the speed performance of a field programmable gate array (FPGA) is presented. It was found that FPGA speed degradation induced by product reliability burn-in was directly related to a large negative threshold voltage (V/sub t/) shift of the surface channel PMOS...

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Hauptverfasser: Pagaduan, F.E., Lee, J.K.J., Vedagarbha, V., Lui, K., Hart, M.J., Gitlin, D., Takaso, T., Kamiyama, S., Nakayama, K.
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creator Pagaduan, F.E.
Lee, J.K.J.
Vedagarbha, V.
Lui, K.
Hart, M.J.
Gitlin, D.
Takaso, T.
Kamiyama, S.
Nakayama, K.
description The impact of plasma-induced damage on the speed performance of a field programmable gate array (FPGA) is presented. It was found that FPGA speed degradation induced by product reliability burn-in was directly related to a large negative threshold voltage (V/sub t/) shift of the surface channel PMOS induced by negative bias temperature (BT) stress. Such negative bias temperature instability (NBTI) in the PMOS was shown to be related to specific back-end plasma processing steps. An overall reduction in NBTI of the PMOSFET was observed when certain plasma processing steps were eliminated which in turn resulted in the reduction of FPGA performance degradation.
doi_str_mv 10.1109/RELPHY.2001.922921
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identifier ISBN: 0780365879
ispartof 2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167), 2001, p.315-318
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Degradation
Field programmable gate arrays
MOSFET circuits
Negative bias temperature instability
Niobium compounds
Plasma materials processing
Plasma temperature
Stress
Threshold voltage
Titanium compounds
title The effects of plasma-induced damage on transistor degradation and the relationship to field programmable gate array performance
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