Developing aged SPICE model for hot carrier reliability simulation

Developing aged SPICE model for hot carrier reliability simulation

A systematic method to develop aged SPICE model for hot carrier reliability simulation is proposed in this paper. This method not only simplifies the aged model develop procedure, but also solves the problem of modeling reverse stress mode and have good model scalability.

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Bibliographische Detailangaben
Hauptverfasser: Qiuyi Ye, Terletzki, H., Tonti, W.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Aging
Curve fitting
Data mining
Degradation
Differential equations
Hot carriers
Microelectronics
Scalability
SPICE
Stress
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Beschreibung
Zusammenfassung:A systematic method to develop aged SPICE model for hot carrier reliability simulation is proposed in this paper. This method not only simplifies the aged model develop procedure, but also solves the problem of modeling reverse stress mode and have good model scalability.
DOI:10.1109/IRWS.2000.911926