Laser removal of particles using tunable wavelength
Summary form only. As semiconductor and microelectronic devices are becoming increasingly smaller, contamination of these devices is becoming an increasing problem for manufacturers. Conventional techniques such as mechanical wiping, scrubbing and etching may involve chemicals and hence pose possibl...
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Format: | Tagungsbericht |
Sprache: | eng |
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Zusammenfassung: | Summary form only. As semiconductor and microelectronic devices are becoming increasingly smaller, contamination of these devices is becoming an increasing problem for manufacturers. Conventional techniques such as mechanical wiping, scrubbing and etching may involve chemicals and hence pose possible environmental problems as well as introducing possible changes in surface profile. Therefore steps have been taken to introduce new techniques that do not pose any of these problems, one such technique is to use lasers. Laser cleaning is versatile, controllable, selective and environmentally friendly. |
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DOI: | 10.1109/CLEOE.2000.909712 |