A comparative study of different plane modelling methodologies for high density electronic packages

There are various methods to model a power and ground plane pair found in the power distribution networks of IC packages and printed circuit boards. In this paper, three such methods are examined. The simulation results are compared with measurements and the relative merits and drawbacks of these me...

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Hauptverfasser:	Yong Kee Yeo, Shih Yen Lee, Iyer, M.K., Mook Seng Leong
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Circuit simulation Distributed parameter circuits Electronics packaging Frequency Integrated circuit modeling Integrated circuit packaging Power systems Power transmission lines Printed circuits Transmission line matrix methods
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Beschreibung
Zusammenfassung:	There are various methods to model a power and ground plane pair found in the power distribution networks of IC packages and printed circuit boards. In this paper, three such methods are examined. The simulation results are compared with measurements and the relative merits and drawbacks of these methods are discussed.
DOI:	10.1109/EPTC.2000.906375