Crossbar-Constrained Technology Mapping for ReRAM Based In-Memory Computing
In-memory computing has gained significant attention due to the potential for dramatic improvement in speed and energy. Redox-based resistive RAMs (ReRAMs), capable of non-volatile storage and logic operations simultaneously have been used for logic-in-memory computing approaches. To this effect, we...
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Veröffentlicht in: | IEEE transactions on computers 2020-05, Vol.69 (5), p.734-748 |
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Zusammenfassung: | In-memory computing has gained significant attention due to the potential for dramatic improvement in speed and energy. Redox-based resistive RAMs (ReRAMs), capable of non-volatile storage and logic operations simultaneously have been used for logic-in-memory computing approaches. To this effect, we propose Re RAM based V LIW A rchitecture for in- M emory com P uting (ReVAMP), supported by a detailed device-accurate simulation setup with peripheral circuitry. We present theoretical bounds on the minimum area required for in-memory computation of arbitrary Boolean functions specified using structural representation (And-Inverter Graph and Majority-Inverter Graph) and two-level representation (Exclusive-Sum-of-Product). To support the ReVAMP architecture, we present two technology mapping flows that fully exploit the bit-level parallelism offered by the execution of logic using ReRAM crossbar array. The area-constrained mapping ( ArC ) generates feasible mapping for a variety of crossbar dimensions while the delay-constrained mapping ( DeC ) focuses primarily on minimizing the latency of mapping. We evaluate the proposed mappings against two state-of-the-art technology in-memory computing architectures, PLiM and MAGIC along with their automation flows (SIMPLE and COMPACT). ArC and DeC outperform state-of-the-art PLiM architecture by 1.46\times 1.46× and 4.3\times 4.3× on average in latency. ArC offers significantly lower area (on average 25.27\times 25.27× and 6.57\times 6.57× ), while improving the area-d |
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ISSN: | 0018-9340 1557-9956 |
DOI: | 10.1109/TC.2020.2964671 |