Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers

Solder anisotropic conductive films (ACFs) consist of conductive solder particles, polymer resin, and flux activator. The flux activator removes solder oxide of solder particles by generated acid for the solder wetting during a thermocompression bonding process. In this article, eutectic Sn52In sold...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2019-11, Vol.9 (11), p.2152-2159
Hauptverfasser:	Park, Jae-Hyeong, Park, Jong Cheol, Shin, SangMyung, Paik, Kyung-Wook
Format:	Artikel
Sprache:	eng
Schlagworte:	Anisotropy Bonding Conductive films Conductivity Electronics packaging Epoxy resins Eutectic Sn52In solder Flexible printed circuits flexible ultrasonic transducer Lead zirconate titanates Low temperature solder anisotropic conductive films (ACFs) Transducers Ultrasonic transducers Wetting
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Beschreibung
Zusammenfassung:	Solder anisotropic conductive films (ACFs) consist of conductive solder particles, polymer resin, and flux activator. The flux activator removes solder oxide of solder particles by generated acid for the solder wetting during a thermocompression bonding process. In this article, eutectic Sn52In solder (Tm = 118°) particles were used as the conductive solder particle in the solder ACFs to reduce
ISSN:	2156-3950 2156-3985
DOI:	10.1109/TCPMT.2019.2945016