Compact mm-Wave Bandpass Filters Using Silicon Integrated Passive Device Technology

In this letter, a compact bandpass filter (BPF) using integrated passive device (IPD) technology is presented, which is based on a pair of coupled-line inductors. To analyze the principle of this design, a simple but effective equivalent circuit model is provided. Using this model, it is easy to inc...

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Veröffentlicht in:IEEE microwave and wireless components letters 2019-10, Vol.29 (10), p.638-640
Hauptverfasser: Kim, Dong-Min, Min, Byung-Wook, Yook, Jong-Min
Format: Artikel
Sprache:eng
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Zusammenfassung:In this letter, a compact bandpass filter (BPF) using integrated passive device (IPD) technology is presented, which is based on a pair of coupled-line inductors. To analyze the principle of this design, a simple but effective equivalent circuit model is provided. Using this model, it is easy to increase the number of resonators order. This structure is implemented by using a Si-based IPD process in which line inductors are located on a thick laminated organic (H = 40 μm) with a ground metal for shielding of lossy silicon. The minimum insertion loss of two-resonator BPF is 1.1 dB, and cascaded two-resonator structure is 2.3 dB. The size of two-resonator and cascaded two-resonator BPFs, excluding the pads, are only 0.246 mm × 0.44 mm and 0.492 mm × 0.88 mm, respectively.
ISSN:1531-1309
2771-957X
1558-1764
2771-9588
DOI:10.1109/LMWC.2019.2936688