An Adaptive Thermal-Aware ECC Scheme for Reliable STT-MRAM LLC Design
Considering the insatiable demand for high-performance computing, on-chip cache capacity increases rapidly. Spin-transfer-torque magnetoresistive random-access memory (STT-MRAM) is a promising cache candidate due to ultralow standby power, high-access speed, and integration density. Unfortunately, w...
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Veröffentlicht in: | IEEE transactions on very large scale integration (VLSI) systems 2019-08, Vol.27 (8), p.1851-1860 |
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Sprache: | eng |
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Zusammenfassung: | Considering the insatiable demand for high-performance computing, on-chip cache capacity increases rapidly. Spin-transfer-torque magnetoresistive random-access memory (STT-MRAM) is a promising cache candidate due to ultralow standby power, high-access speed, and integration density. Unfortunately, when the feature size of magnetic tunnel junction (MTJ) scales down to 1 Xnm, read current approaches write current closely, which may result in read disturbance threatening the reliability of STT-MRAM. Furthermore, the elevating on-chip temperature reduces the thermal stability of STT-MRAM remarkably and aggravates the read disturbance. Error correction code (ECC) is an effective technique to enhance memory reliability. In this paper, we take advantage of the thermal dependence of STT-MRAM and propose a thermally adaptive ECC design, called "Chameleon," that can adjust the ECC protection strength dynamically to reduce the ECC storage overhead and improve the cache access performance and energy efficiency. Experimental results show that compared to the conservative nonadaptive ECC scheme, our design can improve both cache performance and energy consumption effectively. |
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ISSN: | 1063-8210 1557-9999 |
DOI: | 10.1109/TVLSI.2019.2913207 |