Packaging of a monolithic microwave/optical receiver chip with an optical fiber
Summary form only given. Here we report on the design and operation of a high-speed monolithically integrated GaAs receiver with MSM photodetector. We also report on a packaging approach to reliably couple light from an optical fiber on to the planar detector. This approach utilizes Si V-groove tech...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Tagungsbericht |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Summary form only given. Here we report on the design and operation of a high-speed monolithically integrated GaAs receiver with MSM photodetector. We also report on a packaging approach to reliably couple light from an optical fiber on to the planar detector. This approach utilizes Si V-groove technology and flip-chip bonding to achieve the required alignment tolerances. |
---|