Packaging of a monolithic microwave/optical receiver chip with an optical fiber

Summary form only given. Here we report on the design and operation of a high-speed monolithically integrated GaAs receiver with MSM photodetector. We also report on a packaging approach to reliably couple light from an optical fiber on to the planar detector. This approach utilizes Si V-groove tech...

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Hauptverfasser: Vusirikala, V., Heim, P.J.S., Dagenais, M., McClay, C.P.
Format: Tagungsbericht
Sprache:eng
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Zusammenfassung:Summary form only given. Here we report on the design and operation of a high-speed monolithically integrated GaAs receiver with MSM photodetector. We also report on a packaging approach to reliably couple light from an optical fiber on to the planar detector. This approach utilizes Si V-groove technology and flip-chip bonding to achieve the required alignment tolerances.