Reliability study of sub 100 micron pitch, flex-to-ITO/glass interconnection, bonded with an anisotropic conductive film

Reliability study of sub 100 micron pitch, flex-to-ITO/glass interconnection, bonded with an anisotropic conductive film

The objective of this study was to qualify a 3M Z-Axis (anisotropic) conductive film for use in applications calling for sub 100 /spl mu/m pitch flex to ITO/glass connections. For the environmental stability tests, the following accelerated aging conditions were studied: 100/spl deg/C dry, 125/spl d...

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Bibliographische Detailangaben
Hauptverfasser: Murray, C.T., Hogerton, P.B., Chheang, T., Rudman, R.L., Egeberg, H.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Anisotropic conductive films
Anisotropic magnetoresistance
Bonding
Conducting materials
Conductive adhesives
Curing
Electric resistance
Glass
Integrated circuit interconnections
Substrates
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Zusammenfassung:The objective of this study was to qualify a 3M Z-Axis (anisotropic) conductive film for use in applications calling for sub 100 /spl mu/m pitch flex to ITO/glass connections. For the environmental stability tests, the following accelerated aging conditions were studied: 100/spl deg/C dry, 125/spl deg/C dry, -40/spl deg/C/100/spl deg/C cycle, -55/spl deg/ C/125/spl deg/C shock, 60/spl deg/ C/95%RH and 85/spl deg/ C/85%RH. We examined both the electrical and peel performance of these bonds after environmental aging.
DOI:10.1109/ADHES.2000.860599