Nanoscale elastic imaging: a new metrology tool for low-k dielectric integration

Nanoscale elastic imaging: a new metrology tool for low-k dielectric integration

A new characterization tool based on ultrasonic force microscopy (UFM) has been developed to image the nanoscale mechanical properties of metal/low-k polymer damascence test structures. Metal and polymer regions are differentiated on the basis of elastic modulus with a spatial resolution /spl les/10...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Shekhawat, G.S., Kolosov, O.V., Briggs, G.A.D., Shaffer, E.O., Martin, S.J., Geer, R.E.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Artificial intelligence
Dielectric constant
Dielectric materials
Integrated circuit interconnections
Metrology
Polymers
Silicon compounds
Surface topography
Testing
Ultrasonic imaging
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A new characterization tool based on ultrasonic force microscopy (UFM) has been developed to image the nanoscale mechanical properties of metal/low-k polymer damascence test structures. Metal and polymer regions are differentiated on the basis of elastic modulus with a spatial resolution /spl les/10 nm. This technique reveals a RIE-induced hardening of the low-k polymer at the metal/polymer interface and offers new opportunities for metrological reliability evaluation of low-k integration processes.
DOI:10.1109/IITC.2000.854293