Design of Boosted Supply Modulator With Reverse Current Protection for Wide Battery Range in Envelope Tracking Operation
This paper presents a hybrid supply modulator (SM) including a buck-boost (BB) converter, which has wide battery operating range for cellular envelope tracking (ET) applications. The proposed SM supports both ET and average power tracking (APT) mode depending on the power amplifier (PA) output power...
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Veröffentlicht in: | IEEE transactions on microwave theory and techniques 2019-01, Vol.67 (1), p.183-194 |
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Sprache: | eng |
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Zusammenfassung: | This paper presents a hybrid supply modulator (SM) including a buck-boost (BB) converter, which has wide battery operating range for cellular envelope tracking (ET) applications. The proposed SM supports both ET and average power tracking (APT) mode depending on the power amplifier (PA) output power level. The output voltage swing of SM is boosted up to 4.5 V by the integrated BB converter as a supply of a linear amplifier. The dynamic-controlled BB output increases ET operating range, whose efficiency is higher than that of APT, by scaling down the supply voltage of the linear amplifier according to the PA output power level. A selective supply voltage of a switching amplifier and a reverse current sensing circuit are employed to prevent the reverse current through the power inductor of the switching amplifier. The proposed automatic current ratio controller between the linear amplifier and the switching amplifier provides the robust performance against the battery voltage variation of 3.2-4.6 V. A programmable bias current of the class-AB output buffer and a programmable hysteretic comparator are employed to achieve the optimum efficiency and bandwidth depending on the operating signal bandwidth. Optimal control for low signal bandwidth applications such as voice over Long-Term Evolution (LTE) with the selective notch filter provides the maximum efficiency of 88.2% with −135 dBm/Hz output noise. The proposed SM supports the LTE 20-MHz envelope signal with 78% efficiency at 800-mW output. Adapting the designed SM to frequency-division duplex Band3 radio frequency PA, the implemented ET-PA achieves the power added efficiency of 41.6% at 27-dBm PA output power while achieving −40 dBc of E-UTRA ACLR and −137 dBm/Hz of receiver band noise. The chip is implemented in the 0.13- \mu \text{m} CMOS process, and the die size is 5 mm 2 . |
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ISSN: | 0018-9480 1557-9670 |
DOI: | 10.1109/TMTT.2018.2879323 |