Study on rate-dependent behaviors of underfills based on two-phase composites

Study on rate-dependent behaviors of underfills based on two-phase composites

Underfills' properties are very important for the reliability of flip chip packages. As epoxy based materials, underfills show obvious rate-dependent behaviors under mechanical loading. However, studies on the rate-dependent behavior of underfills have been rarely reported, In this paper, the r...

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Hauptverfasser: Haiying Wang, Zhengfang Qian, Minfu Lu, Sheng Liu, Jiali Wu, Wong, C.P.
Format: Tagungsbericht
Sprache:eng
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Additives
Conducting materials
Elasticity
Electronic packaging thermal management
Epoxy resins
Materials science and technology
Micromechanical devices
Shape
Thermal conductivity
Viscosity
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creator Haiying Wang
Zhengfang Qian
Minfu Lu
Sheng Liu
Jiali Wu
Wong, C.P.
description Underfills' properties are very important for the reliability of flip chip packages. As epoxy based materials, underfills show obvious rate-dependent behaviors under mechanical loading. However, studies on the rate-dependent behavior of underfills have been rarely reported, In this paper, the rate-dependent strain-stress behavior of underfills is studied based on two-phase composite assumption. A micromechanical method is employed to predict the overall strain-stress behavior of underfills. Results show good agreement between the predicted data and experimental data.
doi_str_mv 10.1109/ECTC.2000.853175
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subjects Additives
Conducting materials
Elasticity
Electronic packaging thermal management
Epoxy resins
Materials science and technology
Micromechanical devices
Shape
Thermal conductivity
Viscosity
title Study on rate-dependent behaviors of underfills based on two-phase composites
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