Study on rate-dependent behaviors of underfills based on two-phase composites

Study on rate-dependent behaviors of underfills based on two-phase composites

Underfills' properties are very important for the reliability of flip chip packages. As epoxy based materials, underfills show obvious rate-dependent behaviors under mechanical loading. However, studies on the rate-dependent behavior of underfills have been rarely reported, In this paper, the r...

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Bibliographische Detailangaben
Hauptverfasser: Haiying Wang, Zhengfang Qian, Minfu Lu, Sheng Liu, Jiali Wu, Wong, C.P.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Additives
Conducting materials
Elasticity
Electronic packaging thermal management
Epoxy resins
Materials science and technology
Micromechanical devices
Shape
Thermal conductivity
Viscosity
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Zusammenfassung:Underfills' properties are very important for the reliability of flip chip packages. As epoxy based materials, underfills show obvious rate-dependent behaviors under mechanical loading. However, studies on the rate-dependent behavior of underfills have been rarely reported, In this paper, the rate-dependent strain-stress behavior of underfills is studied based on two-phase composite assumption. A micromechanical method is employed to predict the overall strain-stress behavior of underfills. Results show good agreement between the predicted data and experimental data.
DOI:10.1109/ECTC.2000.853175