RF Performance of a Highly Linear Power Amplifier EDNMOS Transistor on Trap-Rich SOI

Results specific to power amplifiers (PAs) designed using a SOI EDNMOS transistor free of kinks in ID-VD plane and high breakdown voltage are presented. The suppression of the drain current kink and improvement in breakdown voltage are achieved by the omission of the N + source implant step. Instead...

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Veröffentlicht in:IEEE electron device letters 2018-09, Vol.39 (9), p.1346-1349
Hauptverfasser: Toh, Rui Tze, Ang, Diing Shenp, Parthasarathy, Shyam, Wong, Jen Shuang, Yap, Hin Kiong, Zhang, Shaoqiang
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container_end_page 1349
container_issue 9
container_start_page 1346
container_title IEEE electron device letters
container_volume 39
creator Toh, Rui Tze
Ang, Diing Shenp
Parthasarathy, Shyam
Wong, Jen Shuang
Yap, Hin Kiong
Zhang, Shaoqiang
description Results specific to power amplifiers (PAs) designed using a SOI EDNMOS transistor free of kinks in ID-VD plane and high breakdown voltage are presented. The suppression of the drain current kink and improvement in breakdown voltage are achieved by the omission of the N + source implant step. Instead, the source junction is realized by an optimized NLDD implant step only, allowing the formation of an under-source body contact. This approach is highly suitable for integration with RF switch and low-noise amplifiers on the same thin film SOI substrate. The improved channel conductance is found to give rise to highly linear amplitude and phase characteristics under high power conditions when the optimized EDNMOS device is used standalone as a PA.
doi_str_mv 10.1109/LED.2018.2855442
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subjects Amplifier design
Breakdown
EDMOS
Electric potential
high-resistivity SOI
Implants
Junctions
kink effect
Logic gates
Performance evaluation
Power amplifiers
Radio frequency
Resistance
RF power amplifier
silicon-on-insulator
Substrates
Thin films
Transistors
title RF Performance of a Highly Linear Power Amplifier EDNMOS Transistor on Trap-Rich SOI
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