Wideband 240-GHz Transmitter and Receiver in BiCMOS Technology With 25-Gbit/s Data Rate

In this paper, a fully integrated wideband 240-GHz transceiver front-end, supporting BPSK modulation scheme, with on-chip antenna is demonstrated in SiGe:C BiCMOS technology with f_{\text {T}}/f_{\text {max}}\,\,= 300/500 GHz and local backside etching option. Within the transmitter, the upconvers...

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Veröffentlicht in:IEEE journal of solid-state circuits 2018-09, Vol.53 (9), p.2532-2542
Hauptverfasser: Eissa, Mohamed Hussein, Malignaggi, Andrea, Wang, Ruoyu, Elkhouly, Mohamed, Schmalz, Klaus, Ulusoy, Ahmet Cagri, Kissinger, Dietmar
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Sprache:eng
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Zusammenfassung:In this paper, a fully integrated wideband 240-GHz transceiver front-end, supporting BPSK modulation scheme, with on-chip antenna is demonstrated in SiGe:C BiCMOS technology with f_{\text {T}}/f_{\text {max}}\,\,= 300/500 GHz and local backside etching option. Within the transmitter, the upconversion is provided by fundamental mixing using a modified Gilbert cell mixer driven by a multiplier-by-eight local oscillator (LO) chain. The transmitter achieves a 3-dB RF bandwidth of 35 GHz with a saturated output power of −0.8 dBm. The down converter is equipped with a mixer first architecture. The mixer is designed utilizing a transimpedance amplifier as load for enhanced noise and bandwidth performance. For dc-coupled receiver, two dc offset cancellation loops are implemented within the receiver chain. It achieves a 3-dB RF bandwidth of 55 GHz, minimum single-sideband noise figure (SSB NF) of 13.4 dB, and a gain of 32 dB with 25-dB gain control. A wideband on-chip double-folded dipole antenna and an on-board optical lens are utilized to demonstrate a wireless link achieving 20- and 25-Gb/s data rates at bit error rates (BERs) of 6.3 \times 10^{-6} and 2.2\times 10^{-4} , respectively, across a distance of 15 cm. The transmitter and receiver consume 375 and 575 mW, respectively, which correspond to power efficiencies of 15 pJ/bit for the transmitter and 23 pJ/bit for the receiver. They occupy a silicon area of 4.3 and 4.5 mm 2 , respectively.
ISSN:0018-9200
1558-173X
DOI:10.1109/JSSC.2018.2839037