Static component interconnect test technology (SCITT) a new technology for assembly testing

Static component interconnect test technology (SCITT) a new technology for assembly testing

Modern packaging technology combined with densely populated assemblies requires efficient design for test features. In particular, modern memories with complex interfaces need to be addressed. This paper presents the details of a test technology that makes assembly test more efficient. The method is...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Biewenga, A., Hollmann, H.D.L., Frans de Jong, Lousberg, M.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Assembly
Binary search trees
Circuit faults
Circuit testing
Electronic equipment testing
Fault diagnosis
History
Integrated circuit interconnections
Manufacturing
Packaging
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 448
container_issue
container_start_page 439
container_title
container_volume
creator Biewenga, A.
Hollmann, H.D.L.
Frans de Jong
Lousberg, M.
description Modern packaging technology combined with densely populated assemblies requires efficient design for test features. In particular, modern memories with complex interfaces need to be addressed. This paper presents the details of a test technology that makes assembly test more efficient. The method is based on the implementation of XOR and XNOR gates to bypass a functional circuit. It is compatible yet complimentary to boundary-scan. Mathematical proof and simulation results show the effectiveness of this method for detection and diagnosis of assembly faults. Known alternatives are compared for test coverage.
doi_str_mv 10.1109/TEST.1999.805766
format Conference Proceeding
fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_805766</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>805766</ieee_id><sourcerecordid>805766</sourcerecordid><originalsourceid>FETCH-LOGICAL-i87t-3d1a6bb40a9c24fbfac30648f5cf054ffb6aaa8ec71d9893f80bdd9fe4f6db0a3</originalsourceid><addsrcrecordid>eNpNkD1PwzAYhC0-JNLCjpg8wpDw2o4Te0RRgUqVGOKNobIduwQlThVbQvn3CMrAcjc8umc4hG4JFISAfFSbVhVESlkI4HVVnaGMslrklHI4RyuoBTBec0YuUEZAyJxxJq_QKsZPAAqcQobe26RTb7GdxuMUXEi4D8nNdgrB2YSTiz9hP8I0TIcF37fNVqkHrHFwX_-Bn2asY3SjGZbfVR8O1-jS6yG6m79eI_W8Uc1rvnt72TZPu7wXdcpZR3RlTAlaWlp647VlUJXCc-uBl96bSmstnK1JJ4VkXoDpOuld6avOgGZrdHfS9s65_XHuRz0v-9Ml7BvQ81YG</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Static component interconnect test technology (SCITT) a new technology for assembly testing</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Biewenga, A. ; Hollmann, H.D.L. ; Frans de Jong ; Lousberg, M.</creator><creatorcontrib>Biewenga, A. ; Hollmann, H.D.L. ; Frans de Jong ; Lousberg, M.</creatorcontrib><description>Modern packaging technology combined with densely populated assemblies requires efficient design for test features. In particular, modern memories with complex interfaces need to be addressed. This paper presents the details of a test technology that makes assembly test more efficient. The method is based on the implementation of XOR and XNOR gates to bypass a functional circuit. It is compatible yet complimentary to boundary-scan. Mathematical proof and simulation results show the effectiveness of this method for detection and diagnosis of assembly faults. Known alternatives are compared for test coverage.</description><identifier>ISSN: 1089-3539</identifier><identifier>ISBN: 0780357531</identifier><identifier>ISBN: 9780780357532</identifier><identifier>EISSN: 2378-2250</identifier><identifier>DOI: 10.1109/TEST.1999.805766</identifier><language>eng</language><publisher>IEEE</publisher><subject>Assembly ; Binary search trees ; Circuit faults ; Circuit testing ; Electronic equipment testing ; Fault diagnosis ; History ; Integrated circuit interconnections ; Manufacturing ; Packaging</subject><ispartof>International Test Conference 1999. Proceedings (IEEE Cat. No.99CH37034), 1999, p.439-448</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/805766$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2056,4040,4041,27916,54911</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/805766$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Biewenga, A.</creatorcontrib><creatorcontrib>Hollmann, H.D.L.</creatorcontrib><creatorcontrib>Frans de Jong</creatorcontrib><creatorcontrib>Lousberg, M.</creatorcontrib><title>Static component interconnect test technology (SCITT) a new technology for assembly testing</title><title>International Test Conference 1999. Proceedings (IEEE Cat. No.99CH37034)</title><addtitle>TEST</addtitle><description>Modern packaging technology combined with densely populated assemblies requires efficient design for test features. In particular, modern memories with complex interfaces need to be addressed. This paper presents the details of a test technology that makes assembly test more efficient. The method is based on the implementation of XOR and XNOR gates to bypass a functional circuit. It is compatible yet complimentary to boundary-scan. Mathematical proof and simulation results show the effectiveness of this method for detection and diagnosis of assembly faults. Known alternatives are compared for test coverage.</description><subject>Assembly</subject><subject>Binary search trees</subject><subject>Circuit faults</subject><subject>Circuit testing</subject><subject>Electronic equipment testing</subject><subject>Fault diagnosis</subject><subject>History</subject><subject>Integrated circuit interconnections</subject><subject>Manufacturing</subject><subject>Packaging</subject><issn>1089-3539</issn><issn>2378-2250</issn><isbn>0780357531</isbn><isbn>9780780357532</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1999</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpNkD1PwzAYhC0-JNLCjpg8wpDw2o4Te0RRgUqVGOKNobIduwQlThVbQvn3CMrAcjc8umc4hG4JFISAfFSbVhVESlkI4HVVnaGMslrklHI4RyuoBTBec0YuUEZAyJxxJq_QKsZPAAqcQobe26RTb7GdxuMUXEi4D8nNdgrB2YSTiz9hP8I0TIcF37fNVqkHrHFwX_-Bn2asY3SjGZbfVR8O1-jS6yG6m79eI_W8Uc1rvnt72TZPu7wXdcpZR3RlTAlaWlp647VlUJXCc-uBl96bSmstnK1JJ4VkXoDpOuld6avOgGZrdHfS9s65_XHuRz0v-9Ml7BvQ81YG</recordid><startdate>1999</startdate><enddate>1999</enddate><creator>Biewenga, A.</creator><creator>Hollmann, H.D.L.</creator><creator>Frans de Jong</creator><creator>Lousberg, M.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>1999</creationdate><title>Static component interconnect test technology (SCITT) a new technology for assembly testing</title><author>Biewenga, A. ; Hollmann, H.D.L. ; Frans de Jong ; Lousberg, M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i87t-3d1a6bb40a9c24fbfac30648f5cf054ffb6aaa8ec71d9893f80bdd9fe4f6db0a3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1999</creationdate><topic>Assembly</topic><topic>Binary search trees</topic><topic>Circuit faults</topic><topic>Circuit testing</topic><topic>Electronic equipment testing</topic><topic>Fault diagnosis</topic><topic>History</topic><topic>Integrated circuit interconnections</topic><topic>Manufacturing</topic><topic>Packaging</topic><toplevel>online_resources</toplevel><creatorcontrib>Biewenga, A.</creatorcontrib><creatorcontrib>Hollmann, H.D.L.</creatorcontrib><creatorcontrib>Frans de Jong</creatorcontrib><creatorcontrib>Lousberg, M.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Biewenga, A.</au><au>Hollmann, H.D.L.</au><au>Frans de Jong</au><au>Lousberg, M.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Static component interconnect test technology (SCITT) a new technology for assembly testing</atitle><btitle>International Test Conference 1999. Proceedings (IEEE Cat. No.99CH37034)</btitle><stitle>TEST</stitle><date>1999</date><risdate>1999</risdate><spage>439</spage><epage>448</epage><pages>439-448</pages><issn>1089-3539</issn><eissn>2378-2250</eissn><isbn>0780357531</isbn><isbn>9780780357532</isbn><abstract>Modern packaging technology combined with densely populated assemblies requires efficient design for test features. In particular, modern memories with complex interfaces need to be addressed. This paper presents the details of a test technology that makes assembly test more efficient. The method is based on the implementation of XOR and XNOR gates to bypass a functional circuit. It is compatible yet complimentary to boundary-scan. Mathematical proof and simulation results show the effectiveness of this method for detection and diagnosis of assembly faults. Known alternatives are compared for test coverage.</abstract><pub>IEEE</pub><doi>10.1109/TEST.1999.805766</doi><tpages>10</tpages></addata></record>
fulltext fulltext_linktorsrc
identifier ISSN: 1089-3539
ispartof International Test Conference 1999. Proceedings (IEEE Cat. No.99CH37034), 1999, p.439-448
issn 1089-3539
2378-2250
language eng
recordid cdi_ieee_primary_805766
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Assembly
Binary search trees
Circuit faults
Circuit testing
Electronic equipment testing
Fault diagnosis
History
Integrated circuit interconnections
Manufacturing
Packaging
title Static component interconnect test technology (SCITT) a new technology for assembly testing
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T00%3A38%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Static%20component%20interconnect%20test%20technology%20(SCITT)%20a%20new%20technology%20for%20assembly%20testing&rft.btitle=International%20Test%20Conference%201999.%20Proceedings%20(IEEE%20Cat.%20No.99CH37034)&rft.au=Biewenga,%20A.&rft.date=1999&rft.spage=439&rft.epage=448&rft.pages=439-448&rft.issn=1089-3539&rft.eissn=2378-2250&rft.isbn=0780357531&rft.isbn_list=9780780357532&rft_id=info:doi/10.1109/TEST.1999.805766&rft_dat=%3Cieee_6IE%3E805766%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=805766&rfr_iscdi=true