Static component interconnect test technology (SCITT) a new technology for assembly testing

Modern packaging technology combined with densely populated assemblies requires efficient design for test features. In particular, modern memories with complex interfaces need to be addressed. This paper presents the details of a test technology that makes assembly test more efficient. The method is based on the implementation of XOR and XNOR gates to bypass a functional circuit. It is compatible yet complimentary to boundary-scan. Mathematical proof and simulation results show the effectiveness of this method for detection and diagnosis of assembly faults. Known alternatives are compared for test coverage.