A study on EKC265 bath life and fluorine and carbon contamination on bond pads

A study was conducted on EKC265 cleaning bath life. The Auger analysis technique was used to evaluate the contamination levels of fluorine and carbon on the bond pad after the EKC265 process. The results showed that it is necessary and effective to perform EKC265 cleaning for L95 lots. The contamina...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	An, L.H., Lai, K.K., Chay, W.Y., Hua, Y.N.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Atherosclerosis Costs Electrons Etching Fabrication Failure analysis Measurement standards Reliability engineering Surface contamination Wafer bonding
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