A study on EKC265 bath life and fluorine and carbon contamination on bond pads

A study on EKC265 bath life and fluorine and carbon contamination on bond pads

A study was conducted on EKC265 cleaning bath life. The Auger analysis technique was used to evaluate the contamination levels of fluorine and carbon on the bond pad after the EKC265 process. The results showed that it is necessary and effective to perform EKC265 cleaning for L95 lots. The contamina...

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Bibliographische Detailangaben
Hauptverfasser: An, L.H., Lai, K.K., Chay, W.Y., Hua, Y.N.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Atherosclerosis
Costs
Electrons
Etching
Fabrication
Failure analysis
Measurement standards
Reliability engineering
Surface contamination
Wafer bonding
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Beschreibung
Zusammenfassung:A study was conducted on EKC265 cleaning bath life. The Auger analysis technique was used to evaluate the contamination levels of fluorine and carbon on the bond pad after the EKC265 process. The results showed that it is necessary and effective to perform EKC265 cleaning for L95 lots. The contamination levels of C and F on the surface (0 /spl Aring/) of bond pads were about 20 at% and 7.5 at% at the bath life of 40 lots used currently. However, they were 0 at.% at a depth of 50 /spl Aring/. The results also show that it is possible to extend EKC265 bath life from 40 lots (6 inch) to 50 lots (6 inch) for cost reduction purposes.
DOI:10.1109/SMELEC.1998.781140