Vertical resonant couplers with precise coupling efficiency control fabricated by wafer bonding

A fabrication technique to create complex three-dimensional waveguide devices is effected by using wafer bonding to process two sides of an epitaxial structure. Vertical resonant couplers with precise control over coupling efficiency are demonstrated.

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Veröffentlicht in:IEEE photonics technology letters 1999-08, Vol.11 (8), p.1003-1005
Hauptverfasser: Tishinin, D.V., Dapkus, P.D., Bond, A.E., Kim, I., Lin, C.K., O'Brien, J.
Format: Artikel
Sprache:eng
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Zusammenfassung:A fabrication technique to create complex three-dimensional waveguide devices is effected by using wafer bonding to process two sides of an epitaxial structure. Vertical resonant couplers with precise control over coupling efficiency are demonstrated.
ISSN:1041-1135
1941-0174
DOI:10.1109/68.775327