Modeling of Fermi-Level Pinning Alleviation With MIS Contacts: n and pMOSFETs Cointegration Considerations-Part I

Aiming at overcoming the Fermi-level pinning (FLP) occurring at the metal/semiconductor interfaces, metal/insulator/semiconductor (MIS) contacts to n-Si and p-Si are usually treated in separate optimization studies, yet with no particular insight on their technological compatibility. In this paper,...

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Veröffentlicht in:IEEE transactions on electron devices 2016-09, Vol.63 (9), p.3413-3418
Hauptverfasser: Borrel, Julien, Hutin, Louis, Rozeau, Olivier, Jaud, Marie-Anne, Martinie, Sébastien, Gregoire, Magali, Dubois, Emmanuel, Vinet, Maud
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Sprache:eng
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Zusammenfassung:Aiming at overcoming the Fermi-level pinning (FLP) occurring at the metal/semiconductor interfaces, metal/insulator/semiconductor (MIS) contacts to n-Si and p-Si are usually treated in separate optimization studies, yet with no particular insight on their technological compatibility. In this paper, using 1-D analytical modeling of MIS contacts, it is shown that in order to fully benefit from FLP mitigation on both n- and p-type Si, a single-insertion/single-metallization scheme cannot be considered. In addition, it is demonstrated that associating given numerical values of contact resistivity with MIS contacts results in a thorny problem, since their I-V characteristics are nonsymmetric nonlinear.
ISSN:0018-9383
1557-9646
DOI:10.1109/TED.2016.2590836