20 GHz bandwidth of lasers flip-chip-mounted on microstructured carriers with integrated electrical waveguides
A flip-chip-mounting scheme for high-speed lasers has been realised. The mounting scheme involves a microstructured silicon carrier with integrated membrane transmission lines and self-aligning solder bumps.
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Format: | Tagungsbericht |
Sprache: | eng |
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Zusammenfassung: | A flip-chip-mounting scheme for high-speed lasers has been realised. The mounting scheme involves a microstructured silicon carrier with integrated membrane transmission lines and self-aligning solder bumps. |
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DOI: | 10.1109/ECOC.1998.732504 |