Glass passivated chip-early reliability test
The paper presents a method for the estimation of product reliability based on tests performed at the chip fabrication stage, which is time and money saving for manufacturer. It relates to the manufacture of automotive rectifier diodes in DO21 case. The aim was to establish to a correlation between...
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| container_end_page | 258 vol.1 |
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| container_start_page | 255 |
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| creator | Bucheru, B.T. Turtudau, F. Ichim, A. Iosif, R. Marinescu, V.A. |
| description | The paper presents a method for the estimation of product reliability based on tests performed at the chip fabrication stage, which is time and money saving for manufacturer. It relates to the manufacture of automotive rectifier diodes in DO21 case. The aim was to establish to a correlation between the pressure resistance of chips and the results of standard reliability test, RTV (rapid thermal variations). |
| doi_str_mv | 10.1109/SMICND.1998.732364 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_732364</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>732364</ieee_id><sourcerecordid>732364</sourcerecordid><originalsourceid>FETCH-LOGICAL-i104t-fa2323be5a91e43902909310c9e65f117cb422f4828abc952f6f7b16e3975a043</originalsourceid><addsrcrecordid>eNotj81KxEAQhAdEUNa8wJ7yACb2_GXSR4m6LuzqQT0vPbEHR0YImUHI2xtYi6K-WxUlxFZCKyXg3dtxP7w8tBKxb51WujMXokLXw2ptjFbuSlQ5f8MqYy2AvRa3u0Q519Ma8ZcKf9bjV5wapjkt9cwpko8plqUunMuNuAyUMlf_3IiPp8f34bk5vO72w_2hiRJMaQKpdd2zJZRsNIJCQC1hRO5skNKN3igVTK968iNaFbrgvOxYo7MERm_E9twbmfk0zfGH5uV0vqT_ADVJQII</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Glass passivated chip-early reliability test</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Bucheru, B.T. ; Turtudau, F. ; Ichim, A. ; Iosif, R. ; Marinescu, V.A.</creator><creatorcontrib>Bucheru, B.T. ; Turtudau, F. ; Ichim, A. ; Iosif, R. ; Marinescu, V.A.</creatorcontrib><description>The paper presents a method for the estimation of product reliability based on tests performed at the chip fabrication stage, which is time and money saving for manufacturer. It relates to the manufacture of automotive rectifier diodes in DO21 case. The aim was to establish to a correlation between the pressure resistance of chips and the results of standard reliability test, RTV (rapid thermal variations).</description><identifier>ISBN: 9780780344327</identifier><identifier>ISBN: 0780344324</identifier><identifier>DOI: 10.1109/SMICND.1998.732364</identifier><language>eng</language><publisher>IEEE</publisher><subject>Assembly ; Automotive engineering ; Glass ; Performance evaluation ; Semiconductor device manufacture ; Semiconductor diodes ; Silicon ; Stress ; Testing ; Thermal resistance</subject><ispartof>1998 International Semiconductor Conference. CAS'98 Proceedings (Cat. No.98TH8351), 1998, Vol.1, p.255-258 vol.1</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/732364$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2056,4048,4049,27924,54919</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/732364$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Bucheru, B.T.</creatorcontrib><creatorcontrib>Turtudau, F.</creatorcontrib><creatorcontrib>Ichim, A.</creatorcontrib><creatorcontrib>Iosif, R.</creatorcontrib><creatorcontrib>Marinescu, V.A.</creatorcontrib><title>Glass passivated chip-early reliability test</title><title>1998 International Semiconductor Conference. CAS'98 Proceedings (Cat. No.98TH8351)</title><addtitle>SMICND</addtitle><description>The paper presents a method for the estimation of product reliability based on tests performed at the chip fabrication stage, which is time and money saving for manufacturer. It relates to the manufacture of automotive rectifier diodes in DO21 case. The aim was to establish to a correlation between the pressure resistance of chips and the results of standard reliability test, RTV (rapid thermal variations).</description><subject>Assembly</subject><subject>Automotive engineering</subject><subject>Glass</subject><subject>Performance evaluation</subject><subject>Semiconductor device manufacture</subject><subject>Semiconductor diodes</subject><subject>Silicon</subject><subject>Stress</subject><subject>Testing</subject><subject>Thermal resistance</subject><isbn>9780780344327</isbn><isbn>0780344324</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1998</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj81KxEAQhAdEUNa8wJ7yACb2_GXSR4m6LuzqQT0vPbEHR0YImUHI2xtYi6K-WxUlxFZCKyXg3dtxP7w8tBKxb51WujMXokLXw2ptjFbuSlQ5f8MqYy2AvRa3u0Q519Ma8ZcKf9bjV5wapjkt9cwpko8plqUunMuNuAyUMlf_3IiPp8f34bk5vO72w_2hiRJMaQKpdd2zJZRsNIJCQC1hRO5skNKN3igVTK968iNaFbrgvOxYo7MERm_E9twbmfk0zfGH5uV0vqT_ADVJQII</recordid><startdate>1998</startdate><enddate>1998</enddate><creator>Bucheru, B.T.</creator><creator>Turtudau, F.</creator><creator>Ichim, A.</creator><creator>Iosif, R.</creator><creator>Marinescu, V.A.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>1998</creationdate><title>Glass passivated chip-early reliability test</title><author>Bucheru, B.T. ; Turtudau, F. ; Ichim, A. ; Iosif, R. ; Marinescu, V.A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i104t-fa2323be5a91e43902909310c9e65f117cb422f4828abc952f6f7b16e3975a043</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1998</creationdate><topic>Assembly</topic><topic>Automotive engineering</topic><topic>Glass</topic><topic>Performance evaluation</topic><topic>Semiconductor device manufacture</topic><topic>Semiconductor diodes</topic><topic>Silicon</topic><topic>Stress</topic><topic>Testing</topic><topic>Thermal resistance</topic><toplevel>online_resources</toplevel><creatorcontrib>Bucheru, B.T.</creatorcontrib><creatorcontrib>Turtudau, F.</creatorcontrib><creatorcontrib>Ichim, A.</creatorcontrib><creatorcontrib>Iosif, R.</creatorcontrib><creatorcontrib>Marinescu, V.A.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Bucheru, B.T.</au><au>Turtudau, F.</au><au>Ichim, A.</au><au>Iosif, R.</au><au>Marinescu, V.A.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Glass passivated chip-early reliability test</atitle><btitle>1998 International Semiconductor Conference. CAS'98 Proceedings (Cat. No.98TH8351)</btitle><stitle>SMICND</stitle><date>1998</date><risdate>1998</risdate><volume>1</volume><spage>255</spage><epage>258 vol.1</epage><pages>255-258 vol.1</pages><isbn>9780780344327</isbn><isbn>0780344324</isbn><abstract>The paper presents a method for the estimation of product reliability based on tests performed at the chip fabrication stage, which is time and money saving for manufacturer. It relates to the manufacture of automotive rectifier diodes in DO21 case. The aim was to establish to a correlation between the pressure resistance of chips and the results of standard reliability test, RTV (rapid thermal variations).</abstract><pub>IEEE</pub><doi>10.1109/SMICND.1998.732364</doi></addata></record> |
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| identifier | ISBN: 9780780344327 |
| ispartof | 1998 International Semiconductor Conference. CAS'98 Proceedings (Cat. No.98TH8351), 1998, Vol.1, p.255-258 vol.1 |
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| language | eng |
| recordid | cdi_ieee_primary_732364 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Assembly Automotive engineering Glass Performance evaluation Semiconductor device manufacture Semiconductor diodes Silicon Stress Testing Thermal resistance |
| title | Glass passivated chip-early reliability test |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-13T00%3A53%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Glass%20passivated%20chip-early%20reliability%20test&rft.btitle=1998%20International%20Semiconductor%20Conference.%20CAS'98%20Proceedings%20(Cat.%20No.98TH8351)&rft.au=Bucheru,%20B.T.&rft.date=1998&rft.volume=1&rft.spage=255&rft.epage=258%20vol.1&rft.pages=255-258%20vol.1&rft.isbn=9780780344327&rft.isbn_list=0780344324&rft_id=info:doi/10.1109/SMICND.1998.732364&rft_dat=%3Cieee_6IE%3E732364%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=732364&rfr_iscdi=true |