Glass passivated chip-early reliability test

The paper presents a method for the estimation of product reliability based on tests performed at the chip fabrication stage, which is time and money saving for manufacturer. It relates to the manufacture of automotive rectifier diodes in DO21 case. The aim was to establish to a correlation between...

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Bibliographische Detailangaben
Hauptverfasser:	Bucheru, B.T., Turtudau, F., Ichim, A., Iosif, R., Marinescu, V.A.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Automotive engineering Glass Performance evaluation Semiconductor device manufacture Semiconductor diodes Silicon Stress Testing Thermal resistance
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Beschreibung
Zusammenfassung:	The paper presents a method for the estimation of product reliability based on tests performed at the chip fabrication stage, which is time and money saving for manufacturer. It relates to the manufacture of automotive rectifier diodes in DO21 case. The aim was to establish to a correlation between the pressure resistance of chips and the results of standard reliability test, RTV (rapid thermal variations).
DOI:	10.1109/SMICND.1998.732364