Laser flip-chip mounting for passive alignment and high-frequency modulation

We have developed a silicon motherboard for flip-chip mounting of lasers in a way that is compatible with high-frequency modulation (24 GHz) and which allows passive alignment of the lasers to single-mode fibres.

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Bibliographische Detailangaben
Hauptverfasser:	Lindgren, S., Ahlfeldt, H., Backlin, L., Forssen, L., Vieider, C., Elderstig, H., Svensson, M., Granlund, L., Kerzar, B., Broberg, B., Kjebon, O., Schatz, R., Forzelius, E., Nilsson, S.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding Fiber lasers Frequency modulation Laboratories Optical fiber communication Optical modulation Semiconductor lasers Silicon Surface emitting lasers Wires
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Beschreibung
Zusammenfassung:	We have developed a silicon motherboard for flip-chip mounting of lasers in a way that is compatible with high-frequency modulation (24 GHz) and which allows passive alignment of the lasers to single-mode fibres.