Integration study of benzocyclobutene with CVD-based aluminum metallization

Integration study of benzocyclobutene with CVD-based aluminum metallization

Aluminum/liner binary stacks have been deposited on blanket and patterned films of benzocyclobutene (BCB) polymer to investigate its integration into an all-aluminum multilevel wiring structure. Blanket stacks were characterized for structural properties and reliability. Metallized patterned films w...

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Hauptverfasser: Gundlach, H., Knorr, A., Nijsten, S., Kumar, K., Bian, Z., Talevi, R., Shaffer, E.O., Kaloyeros, A.E., Geer, R.E.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Aluminum
Chemical vapor deposition
Collimators
Filling
Metallization
Pattern analysis
Polymer films
Sputtering
Titanium
Wiring
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Beschreibung
Zusammenfassung:Aluminum/liner binary stacks have been deposited on blanket and patterned films of benzocyclobutene (BCB) polymer to investigate its integration into an all-aluminum multilevel wiring structure. Blanket stacks were characterized for structural properties and reliability. Metallized patterned films were analyzed for gap filling of 0.30 /spl mu/m trenches. Aluminum was deposited via chemical vapor deposition (CVD). Titanium nitride liners were deposited via collimated reactive sputtering.
DOI:10.1109/IITC.1998.704922