Lumped Dynamic Electrothermal Model of IGBT Module of Inverters
This paper presents a lumped dynamic electrothermal model of an insulated gate bipolar transistor module of inverters. The thermal model consists of a 3-D network of RC cells constructed for time-dependent operation. The network was found to be precise for determining the temperature excursion of di...
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Veröffentlicht in: | IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2015-03, Vol.5 (3), p.355-364 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | This paper presents a lumped dynamic electrothermal model of an insulated gate bipolar transistor module of inverters. The thermal model consists of a 3-D network of RC cells constructed for time-dependent operation. The network was found to be precise for determining the temperature excursion of diodes and transistors subsequent to time-dependent power losses. Thermal resistances and capacitances accounting for heat spreading and thermal penetration depth effects were introduced. Electrothermal simulations carried out on a 1200 V-300 A module with a time-dependent average power loss were found to be in good agreement with experiments using infrared thermal imaging. This paper focuses on very-low-frequency behavior (less than 1 Hz) at a switching frequency of 10 kHz. |
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ISSN: | 2156-3950 2156-3985 |
DOI: | 10.1109/TCPMT.2015.2392625 |