Patents and High-Speed Datacenter Interconnects
This column discusses some of the issues surrounding high-speed datacenter interconnects, including bandwidth and interconnect design. It also examines business and software patents.
Gespeichert in:
| Veröffentlicht in: | IEEE MICRO 2014-09, Vol.34 (5), p.4-5 |
|---|---|
| 1. Verfasser: | |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 5 |
|---|---|
| container_issue | 5 |
| container_start_page | 4 |
| container_title | IEEE MICRO |
| container_volume | 34 |
| creator | Altman, Erik R. |
| description | This column discusses some of the issues surrounding high-speed datacenter interconnects, including bandwidth and interconnect design. It also examines business and software patents. |
| doi_str_mv | 10.1109/MM.2014.87 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_ieee_primary_6915619</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>6915619</ieee_id><sourcerecordid>3467615891</sourcerecordid><originalsourceid>FETCH-LOGICAL-c271t-b9f3992fa9f139cef45664591b719d6eb804545da7e78ec7ce582796adde9fdf3</originalsourceid><addsrcrecordid>eNpd0E1Lw0AQBuBFFKzVi1cvAS8ipN3Zz-xR6kcLDQrqedluZjWlTeJuevDfm1Lx4GXmMA8vw0vIJdAJADXTspwwCmJS6CMyAsN1LkDwYzKiTLMcNGen5CylNaVUMlqMyPTF9dj0KXNNlc3rj8_8tUOssnvXOz8cMGaL_fRt06Dv0zk5CW6T8OJ3j8n748PbbJ4vn58Ws7tl7pmGPl-ZwI1hwZkA3HgMQiolpIGVBlMpXBVUSCErp1EX6LVHWTBtlKsqNKEKfExuDrldbL92mHq7rZPHzcY12O6SBcUMV0wpOdDrf3Td7mIzfDcoEFpwI9igbg_KxzaliMF2sd66-G2B2n13tiztvjtb6AFfHXCNiH9QGZBqKPUH6edoDw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1614743942</pqid></control><display><type>article</type><title>Patents and High-Speed Datacenter Interconnects</title><source>IEEE Electronic Library (IEL)</source><creator>Altman, Erik R.</creator><creatorcontrib>Altman, Erik R.</creatorcontrib><description>This column discusses some of the issues surrounding high-speed datacenter interconnects, including bandwidth and interconnect design. It also examines business and software patents.</description><identifier>ISSN: 0272-1732</identifier><identifier>EISSN: 1937-4143</identifier><identifier>DOI: 10.1109/MM.2014.87</identifier><identifier>CODEN: IEMIDZ</identifier><language>eng</language><publisher>Los Alamitos: IEEE</publisher><subject>Bandwidth ; Bandwidths ; Business ; cache ; Computer centers ; Computer programs ; CPU ; data center ; datacenter ; GPU ; High speed ; I/O ; Interconnect ; Interconnections ; interconnects ; network interface card ; NIC ; simulation ; Software ; topology</subject><ispartof>IEEE MICRO, 2014-09, Vol.34 (5), p.4-5</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Sep-Oct 2014</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c271t-b9f3992fa9f139cef45664591b719d6eb804545da7e78ec7ce582796adde9fdf3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6915619$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27923,27924,54757</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6915619$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Altman, Erik R.</creatorcontrib><title>Patents and High-Speed Datacenter Interconnects</title><title>IEEE MICRO</title><addtitle>MM</addtitle><description>This column discusses some of the issues surrounding high-speed datacenter interconnects, including bandwidth and interconnect design. It also examines business and software patents.</description><subject>Bandwidth</subject><subject>Bandwidths</subject><subject>Business</subject><subject>cache</subject><subject>Computer centers</subject><subject>Computer programs</subject><subject>CPU</subject><subject>data center</subject><subject>datacenter</subject><subject>GPU</subject><subject>High speed</subject><subject>I/O</subject><subject>Interconnect</subject><subject>Interconnections</subject><subject>interconnects</subject><subject>network interface card</subject><subject>NIC</subject><subject>simulation</subject><subject>Software</subject><subject>topology</subject><issn>0272-1732</issn><issn>1937-4143</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2014</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpd0E1Lw0AQBuBFFKzVi1cvAS8ipN3Zz-xR6kcLDQrqedluZjWlTeJuevDfm1Lx4GXmMA8vw0vIJdAJADXTspwwCmJS6CMyAsN1LkDwYzKiTLMcNGen5CylNaVUMlqMyPTF9dj0KXNNlc3rj8_8tUOssnvXOz8cMGaL_fRt06Dv0zk5CW6T8OJ3j8n748PbbJ4vn58Ws7tl7pmGPl-ZwI1hwZkA3HgMQiolpIGVBlMpXBVUSCErp1EX6LVHWTBtlKsqNKEKfExuDrldbL92mHq7rZPHzcY12O6SBcUMV0wpOdDrf3Td7mIzfDcoEFpwI9igbg_KxzaliMF2sd66-G2B2n13tiztvjtb6AFfHXCNiH9QGZBqKPUH6edoDw</recordid><startdate>201409</startdate><enddate>201409</enddate><creator>Altman, Erik R.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SC</scope><scope>7SP</scope><scope>8FD</scope><scope>JQ2</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope><scope>F28</scope><scope>FR3</scope></search><sort><creationdate>201409</creationdate><title>Patents and High-Speed Datacenter Interconnects</title><author>Altman, Erik R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c271t-b9f3992fa9f139cef45664591b719d6eb804545da7e78ec7ce582796adde9fdf3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2014</creationdate><topic>Bandwidth</topic><topic>Bandwidths</topic><topic>Business</topic><topic>cache</topic><topic>Computer centers</topic><topic>Computer programs</topic><topic>CPU</topic><topic>data center</topic><topic>datacenter</topic><topic>GPU</topic><topic>High speed</topic><topic>I/O</topic><topic>Interconnect</topic><topic>Interconnections</topic><topic>interconnects</topic><topic>network interface card</topic><topic>NIC</topic><topic>simulation</topic><topic>Software</topic><topic>topology</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Altman, Erik R.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Computer and Information Systems Abstracts</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE MICRO</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Altman, Erik R.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Patents and High-Speed Datacenter Interconnects</atitle><jtitle>IEEE MICRO</jtitle><stitle>MM</stitle><date>2014-09</date><risdate>2014</risdate><volume>34</volume><issue>5</issue><spage>4</spage><epage>5</epage><pages>4-5</pages><issn>0272-1732</issn><eissn>1937-4143</eissn><coden>IEMIDZ</coden><abstract>This column discusses some of the issues surrounding high-speed datacenter interconnects, including bandwidth and interconnect design. It also examines business and software patents.</abstract><cop>Los Alamitos</cop><pub>IEEE</pub><doi>10.1109/MM.2014.87</doi><tpages>2</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 0272-1732 |
| ispartof | IEEE MICRO, 2014-09, Vol.34 (5), p.4-5 |
| issn | 0272-1732 1937-4143 |
| language | eng |
| recordid | cdi_ieee_primary_6915619 |
| source | IEEE Electronic Library (IEL) |
| subjects | Bandwidth Bandwidths Business cache Computer centers Computer programs CPU data center datacenter GPU High speed I/O Interconnect Interconnections interconnects network interface card NIC simulation Software topology |
| title | Patents and High-Speed Datacenter Interconnects |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T21%3A05%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Patents%20and%20High-Speed%20Datacenter%20Interconnects&rft.jtitle=IEEE%20MICRO&rft.au=Altman,%20Erik%20R.&rft.date=2014-09&rft.volume=34&rft.issue=5&rft.spage=4&rft.epage=5&rft.pages=4-5&rft.issn=0272-1732&rft.eissn=1937-4143&rft.coden=IEMIDZ&rft_id=info:doi/10.1109/MM.2014.87&rft_dat=%3Cproquest_RIE%3E3467615891%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=1614743942&rft_id=info:pmid/&rft_ieee_id=6915619&rfr_iscdi=true |