Patents and High-Speed Datacenter Interconnects

This column discusses some of the issues surrounding high-speed datacenter interconnects, including bandwidth and interconnect design. It also examines business and software patents.

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEEE MICRO 2014-09, Vol.34 (5), p.4-5
1. Verfasser: Altman, Erik R.
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:This column discusses some of the issues surrounding high-speed datacenter interconnects, including bandwidth and interconnect design. It also examines business and software patents.
ISSN:0272-1732
1937-4143
DOI:10.1109/MM.2014.87