InGaAs Gate-All-Around Nanowire Devices on 300mm Si Substrates

In this letter, we present the first InGaAs gate-all-around (GAA) nanowire devices fabricated on 300mm Si substrates. For an L G of 60 nm an extrinsic g m of 1030 μS/μm at V ds = 0.5 V is achieved which is a 1.75× increase compared with the replacement fin FinFet process. This improvement is attribu...

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Veröffentlicht in:IEEE electron device letters 2014-11, Vol.35 (11), p.1097-1099
Hauptverfasser: Waldron, Niamh, Merckling, Clement, Teugels, Lieve, Ong, Patrick, Ibrahim, Sheik Ansar Usman, Sebaai, Farid, Pourghaderi, Ali, Barla, Kathy, Collaert, Nadine, Thean, Aaron Voon-Yew
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Sprache:eng
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Zusammenfassung:In this letter, we present the first InGaAs gate-all-around (GAA) nanowire devices fabricated on 300mm Si substrates. For an L G of 60 nm an extrinsic g m of 1030 μS/μm at V ds = 0.5 V is achieved which is a 1.75× increase compared with the replacement fin FinFet process. This improvement is attributed to the elimination of Mg counterdoping in the GAA flow. Ultrascaled nanowires with diameters of 6 nm were demonstrated to show immunity to D it resulting in an SS SAT of 66 mV/decade and negligible drain-induced barrier lowering for 85-nm L G devices.
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2014.2359579