Sputter Deposition of Nanostructured TiO2 Thin Films

A physical vapor deposition (PVD) method using plasma discharge-glancing angle deposition (GLAD), based on a variation of the particle's incidence angle to the substrate, enables the formation of TiO 2 thin films with oriented columnar nanostructure. The incidence angle influences crystalline,...

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Veröffentlicht in:	IEEE transactions on plasma science 2014-10, Vol.42 (10), p.2790-2791
Hauptverfasser:	Horáková, Marta, Cerný, Pavel, Kríž, Pavel, Bartoš, Petr, Špatenka, Petr
Format:	Artikel
Sprache:	eng
Schlagworte:	Educational institutions Magnetrons plasma applications Scanning electron microscopy Sputtering Substrates Surface morphology Surface treatment
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creator	Horáková, Marta Cerný, Pavel Kríž, Pavel Bartoš, Petr Špatenka, Petr
description	A physical vapor deposition (PVD) method using plasma discharge-glancing angle deposition (GLAD), based on a variation of the particle's incidence angle to the substrate, enables the formation of TiO 2 thin films with oriented columnar nanostructure. The incidence angle influences crystalline, nanostructure, and surface properties of the deposited films. Images illustrating the GLAD PVD method and scanning electron microscopy images of the TiO 2 thin films deposited with different incidence angles α are presented.
doi_str_mv	10.1109/TPS.2014.2326896
format	Article
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title	Sputter Deposition of Nanostructured TiO2 Thin Films
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