Sputter Deposition of Nanostructured TiO2 Thin Films

Sputter Deposition of Nanostructured TiO2 Thin Films

A physical vapor deposition (PVD) method using plasma discharge-glancing angle deposition (GLAD), based on a variation of the particle's incidence angle to the substrate, enables the formation of TiO 2 thin films with oriented columnar nanostructure. The incidence angle influences crystalline,...

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Veröffentlicht in:IEEE transactions on plasma science 2014-10, Vol.42 (10), p.2790-2791
Hauptverfasser: Horáková, Marta, Cerný, Pavel, Kríž, Pavel, Bartoš, Petr, Špatenka, Petr
Format: Artikel
Sprache:eng
Schlagworte:
Educational institutions
Magnetrons
plasma applications
Scanning electron microscopy
Sputtering
Substrates
Surface morphology
Surface treatment
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Zusammenfassung:A physical vapor deposition (PVD) method using plasma discharge-glancing angle deposition (GLAD), based on a variation of the particle's incidence angle to the substrate, enables the formation of TiO 2 thin films with oriented columnar nanostructure. The incidence angle influences crystalline, nanostructure, and surface properties of the deposited films. Images illustrating the GLAD PVD method and scanning electron microscopy images of the TiO 2 thin films deposited with different incidence angles α are presented.
ISSN:0093-3813
1939-9375
DOI:10.1109/TPS.2014.2326896